Data
analysis sheet for residual strain
measurements
Figure RS.1.1.
Top view of fixed-fixed beam used to
measure residual strain.
To obtain the
following measurements, consult ASTM
standard test method E 2245 entitled
"Standard Test Method for Residual
Strain Measurements of Thin,
Reflecting Films
Using an Optical Interferometer."
filename of 3-D data set
(optional) =
filename of 2-D data traces
(optional) =
material =
Poly1
Poly2
stacked Poly1 and Poly2
SiC-2
SiC-3
(therefore, t =
µm )
design length =
µm
which fixed-fixed beam on the
round robin test chip ?
First Second
Third
magnification =
×
orientation =
0 degree
90 degree
x-calibration factor
(for the given magnification)
= calx =
maximum field of view (for the
given magnification) = interx
=
µm
one sigma uncertainty in a ruler
measurement (for the given mag)
= σxcal =
µm
resolution of the interferometer
in the x-direction = xres
=
µm
z-calibration factor
(for the given magnification)
= calz =
certified value of step height
standard = cert =
µm standard deviation of step
height measurements (on
double-sided step height
standard) = σzcal
=
µm
resolution of the interferometer
in the z-direction = zres
=
µm
peak-to-valley roughness of a
flat and leveled surface of the
sample material calculated to be
the average of three or more
measurements, each measurement
of which is taken from a
different 2-D data trace = Rtave
=
µm
alignment ensured ?
Yes
No
data leveled ?
Yes
No
Is this fixed-fixed beam
exhibiting stiction ?
Yes
No
If it is exhibiting stiction, do
not fill out the remainder of
this form.
AF=
µm from Trace "b"
w1F=
from
Trace "b"
AS=
µm
from Trace "b"
w3S=
from Trace "b"
xeF=
µm
from Trace "b"
xeS=
µm
from Trace "b"
εr0
=
× 10-6
from Trace "b"
εr
= × 10-6
from Trace "b"
AF=
µm from Trace "c"
w1F=
from Trace "c"
AS=
µm
from Trace "c"
w3S=
from Trace "c"
xeF=
µm
from Trace "c"
xeS=
µm
from Trace "c"
εr0=
× 10-6 from
Trace "c"
εr= × 10-6 from
Trace "c"
usamp= × 10-6 from
Trace "c"
uW= × 10-6
from two or three traces
uxcal= × 10-6 from
Trace "c" uL= × 10-6
from Trace "c"
uzcal= × 10-6 from
Trace "c"
uzres= × 10-6 from
Trace "c"
uxres= × 10-6 from
Trace "c"
uxresL= × 10-6 from
Trace "c"
uc= SQRT[usamp2
+ uW2
+ uxcal2
+ uL2
+ uzcal2
+ uzres2
+ uxres2
+ uxresL2]
uc= × 10-6 from
two or three traces
AF=
µm from Trace "d"
w1F=
from
Trace "d"
AS=
µm
from Trace "d"
w3S=
from Trace "d"
xeF=
µm
from Trace "d"
xeS=
µm
from Trace "d"
εr0
=
× 10-6
from Trace "d"
εr
= × 10-6 from
Trace "d"
Modify the
input data, given the
information supplied in any
flagged statement below, if
applicable, then recalculate:
1.
Please fill out the entire form.
2.
For the round robin test chip,
the thickness value is different
than what the fabricator
specified.
3.
For the round robin test chip,
the design length should be 400,
450, 500, 550, 600, 650, 700,
750, or 800
mm.
4.
The measured value for L
is more than 3ucL
from the design length.
5.
Is the magnification appropriate
given the design length ?
6.
Magnifications at or less than
2.5× shall not be used.
7.
Is 0.95 < calx < 1.05 but
not equal to "1"? If not,
recheck your x-calibration.
8.
The value for
interxshould be
between 0
µm
and 1500
µm.
9.
The value for
σxcal should be
between 0
µm
and 4
µm.
10.
The value for
xres
should be between 0
µm
and 1.57
µm.
11.
Is 0.95 < calz < 1.05 but
not equal to "1" ? If not,
recheck your z-calibration.
12.
The value for
σzcal
should be between 0
µm
and 0.050
µm.
13.
The value for cert should
be greater than 0 µm and less
than 25 µm.
14.
The value for zres
should be greater than 0 µm and
less than or equal to 0.005 µm.
15.
The value for
Rtave should be
between 0
µm
and 0.100
µm.
16.
Alignment has not been ensured.
17.
Data has not been leveled.
18.
x1min should be
greater than x1max.
19.
x2min should be
greater than x1min.
20.
x2max should be
greater than x2min.
21.
The calibrated values for x1min
and x1max are
greater than 10 µm apart.
22.
The calibrated values for x2min
and x2max are
greater than 10 µm apart.
23.
In Traces "b," "c," and "d," the
value for s is not the
same.
24.
x1ave
should be < (x1F
* calx) in all traces.
25.
(x3S * calx)
should be <x2ave
in all traces.
26. In
all traces, make sure ( x1F
< x2F < x3F
).
27. In
all traces, make sure ( x1S
< x2S < x3S
).
28.
For Trace "b," | [(x2F*calx)
− xeF ] | =
µm. Thisshould be
< 5 µm.
If it is not, choose (x2F,
z2F)
such that (x2F
* calx) is closer to xeF
=
µm.
29.
For Trace "b," | [(x2S*calx)
−
xeS ] | =
µm. Thisshould be
< 5 µm.
If it is not, choose (x2S,
z2S)
such that (x2S
* calx) is closer to xeS
=
µm.
30.
For Trace "c," | [(x2F*calx)
− xeF ] | =
µm. Thisshould be
< 5 µm.
If it is not, choose (x2F,
z2F)
such that (x2F
* calx) is closer to xeF
=
µm.
31.
For Trace "c," | [(x2S*calx)
−
xeS ] | =
µm. Thisshould be
< 5 µm.
If it is not, choose (x2S,
z2S)
such that (x2S
* calx) is closer to xeS
=
µm.
32.
For Trace "d," | [(x2F*calx)
− xeF ] | =
µm. Thisshould be
< 5 µm.
If it is not, choose (x2F,
z2F)
such that (x2F
* calx) is closer to xeF
=
µm.
33.
For Trace "d," | [(x2S*calx)
− xeS ] | =
µm. Thisshould be
< 5 µm.
If it is not, choose (x2S,
z2S)
such that (x2S
* calx) is closer to xeS
=
µm.