

a)
b)
Figure SH.4.1.
For thickness test structure
#1: a) a design rendition and b) a
cross-section.
To obtain the
measurements in this data sheet,
consult the following:
[1] J. C.
Marshall and P. T. Vernier,
"Electro-physical Technique for
Post-fabrication
Measurements of
CMOS Process Layer Thicknesses,"
NIST Journal of Research,
Vol. 112, No. 5, 2007, p. 223-256.
[2] SEMI MS2, "Test Method for
Step-Height Measurements of
Thin, Reflecting Films
Using an
Optical Interferometer."