date data taken (optional) = / /
identifying words (optional)   = 
instrument used (optional)   = 
fabrication facility/process (optional)   =   
test chip name/number (optional)   =   
filename of 3-D data set (optional)   = 
filename of 2-D data traces (optional) =
                                                              

Table 1 - Preliminary ESTIMATES			Description
1	material =	Poly1        Poly2       stacked Poly1 and Poly2  SiC-2       SiC-3  other	material
2	displacement =	µm	designed displacement
3	magnification =	×	magnification
4	orientation =	0°              90°       Other	orientation on the chip
5	calx =		x-calibration factor (for the given magnification)
6	interx =	µm	interferometer's maximum field of view (for the given magnification)
7	σxcal =	µm	one sigma uncertainty in a ruler measurement (for the given magnification)
8	xres =	µm	resolution of the interferometer in the x-direction
9	calz =		z-calibration factor (for the given magnification)
10	aligned?	Yes      No	alignment ensured ?
11	leveled?	Yes      No	data leveled ?

                                      

 

Table 2 - INPUTS (uncalibrated values)			Notes
12	x1max (i.e., x1lower) =	µm
13	x1min (i.e., x1upper) =	µm	(x1min > x1max)
14	x2min (i.e., x2lower) =	µm	(x2min > x1min)
15	x2max (i.e., x2upper) =	µm	(x2max > x2min)
16	sep =	µm	pixel-to-pixel spacing (for the given magnification)
17	which values?	Lower      Upper	Use 'lower' or 'upper' values for calculation ?

                                            


OUTPUTS (calibrated values):
            D_1-min =  ( x2_min − x1_min ) * calx =  µm
            D_1-max = ( x2_max − x1_max ) * calx =  µm
            D₁ =  (D_1-min + D_1-max ) / 2 = µm
                     u_D = (D_1-max − D_1-min ) / 6 = µm
                     u_xcal = (σ_xcal / interx) * ( D₁ / calx ) = µm
                     u_xres = x_res *  calx / 1.732 = µm
            u_c = SQRT [ u_D² + u_xcal² + u_xres²] = µm

            D_1low (using lower values) = ( x2_lower − x1_lower ) * calx = µm
                     u_D-low = (2 * sep * calx) / 3 = µm
                     u_xcal-low = (σ_xcal / interx) * ( D_1low / calx ) = µm
            u_clow = SQRT [ u_D-low² + u_xcal-low² + u_xres²] = µm

            D_1up (using upper values) = ( x2_upper − x1_upper ) * calx = µm
                     u_D-up = (2 * sep * calx) / 3 = µm
                     u_xcal-up = (σ_xcal / interx) * ( D_1up / calx ) = µm
            u_cup = SQRT [ u_D-up² + u_xcal-up² + u_xres²] = µm

Report the results as follows:  Since it can be assumed that the possible estimated values are either
approximately uniformly distributed or Gaussian with approximate standard deviation u_c, the deflection
is believed to lie in the interval D₁ ± u_c with a level of confidence of approximately 68 % assuming
a Gaussian distribution. 

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Modify the input data, given the information supplied in any flagged statement below, if applicable, then recalculate:

1.		Please fill out the entire form.
2.		The designed displacement is typically 0.0 µm.
3.		The measured value for D1 is 10 µm greater than the designed displacement.
4.		Is the magnification appropriate given the value for D1 ?
5.		Magnifications at or less than 2.5× shall not be used.
6.		Is 0.95 < calx < 1.05 but not equal to "1" ?  If not, recheck your x-calibration.
7.		The value for interx should be between 0 µm and 1500 µm.
8.		The value for σxcal should be between 0 µm and 4 µm.
9.		The value for xres should be between 0 µm and 1.57 µm.
10.		Is 0.95 < calz < 1.05 but not equal to "1" ?  If not, recheck your z-calibration.
11.		Alignment has not been ensured.
12.		Data has not been leveled.
13.		x1min should be greater than x1max.
14.		x2min should be greater than x1min.
15.		x2max should be greater than x2min.
16.		The calibrated values for x1min and x1max are greater than 10 µm apart.
17.		The calibrated values for x2min and x2max are greater than 10 µm apart.
18.		sep should be between 0 µm and 1.57 µm.

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Email questions or comments to mems-support@nist.gov.

NIST is an agency of the U.S. Commerce Department
The Semiconductor Electronics Division is within the Electronics and Electrical Engineering Laboratory.
The MNT Project (http://www.eeel.nist.gov/812/MNT/index.html) is within the Enabling Devices and ICs Group.

Date created: 12/4/2000
Last updated: 6/2/2009